AX125-FG324
For Reference Only
| Part Number | AX125-FG324 |
| PNEDA Part # | AX125-FG324 |
| Description | IC FPGA 168 I/O 324FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 3,168 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 25 - Nov 30 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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AX125-FG324 Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | AX125-FG324 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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Logistics Mode
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Notes
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AX125-FG324 Specifications
| Manufacturer | Microsemi Corporation |
| Series | Axcelerator |
| Number of LABs/CLBs | 2016 |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 18432 |
| Number of I/O | 168 |
| Number of Gates | 125000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 324-BGA |
| Supplier Device Package | 324-FBGA (19x19) |
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Manufacturer Xilinx Inc. Series Virtex®-E Number of LABs/CLBs 2400 Number of Logic Elements/Cells 10800 Total RAM Bits 163840 Number of I/O 404 Number of Gates 569952 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
