AT24C08D-MAHM-E
For Reference Only
| Part Number | AT24C08D-MAHM-E |
| PNEDA Part # | AT24C08D-MAHM-E |
| Description | IC EEPROM 8K I2C 1MHZ 8UDFN |
| Manufacturer | Microchip Technology |
| Unit Price | Request a Quote |
| In Stock | 137,472 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 18 - Mar 23 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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AT24C08D-MAHM-E Resources
| Brand | Microchip Technology |
| ECAD Module |
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| Mfr. Part Number | AT24C08D-MAHM-E |
| Category | Semiconductors › Memory ICs › Memory |
Payment Method
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- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
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AT24C08D-MAHM-E Specifications
| Manufacturer | Microchip Technology |
| Series | - |
| Memory Type | Non-Volatile |
| Memory Format | EEPROM |
| Technology | EEPROM |
| Memory Size | 8Kb (1K x 8) |
| Memory Interface | I²C |
| Clock Frequency | 1MHz |
| Write Cycle Time - Word, Page | 5ms |
| Access Time | 4.5µs |
| Voltage - Supply | 1.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-UFDFN Exposed Pad |
| Supplier Device Package | 8-UDFN (2x3) |
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Manufacturer Cypress Semiconductor Corp Series - Memory Type Volatile Memory Format SRAM Technology SRAM - Asynchronous Memory Size 16Mb (1M x 16) Memory Interface Parallel Clock Frequency - Write Cycle Time - Word, Page 15ns Access Time 15ns Voltage - Supply 1.65V ~ 2.2V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 54-TSOP (0.400", 10.16mm Width) Supplier Device Package 54-TSOP II |
