APA300-BG456I
For Reference Only
| Part Number | APA300-BG456I | ||||||||||||||||||
| PNEDA Part # | APA300-BG456I | ||||||||||||||||||
| Description | IC FPGA 290 I/O 456BGA | ||||||||||||||||||
| Manufacturer | Microsemi | ||||||||||||||||||
| Unit Price |
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| In Stock | 91 | ||||||||||||||||||
| Warehouses | Shipped from Hong Kong SAR | ||||||||||||||||||
| Estimated Delivery | Nov 28 - Dec 3 (Choose Expedited Shipping) | ||||||||||||||||||
| Guarantee | Up to 1 year [PNEDA-Warranty]* | ||||||||||||||||||
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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APA300-BG456I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | APA300-BG456I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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APA300-BG456I Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASICPLUS |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 73728 |
| Number of I/O | 290 |
| Number of Gates | 300000 |
| Voltage - Supply | 2.3V ~ 2.7V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 456-BBGA |
| Supplier Device Package | 456-PBGA (35x35) |
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Manufacturer Intel Series FLEX 6000 Number of LABs/CLBs 132 Number of Logic Elements/Cells 1320 Total RAM Bits - Number of I/O 117 Number of Gates 16000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Manufacturer Xilinx Inc. Series Virtex®-II Number of LABs/CLBs 3584 Number of Logic Elements/Cells - Total RAM Bits 1769472 Number of I/O 720 Number of Gates 3000000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1152-BBGA, FCBGA Supplier Device Package 1152-CFCBGA (35x35) |
