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AFS250-2FG256

AFS250-2FG256

For Reference Only

Part Number AFS250-2FG256
PNEDA Part # AFS250-2FG256
Description IC FPGA 114 I/O 256FBGA
Manufacturer Microsemi
Unit Price Request a Quote
In Stock 2,664
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Dec 21 - Dec 26 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

AFS250-2FG256 Resources

Brand Microsemi
ECAD Module ECAD
Mfr. Part NumberAFS250-2FG256
CategorySemiconductorsEmbedded Processors & ControllersFPGAs (Field Programmable Gate Array)

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AFS250-2FG256 Specifications

ManufacturerMicrosemi Corporation
SeriesFusion®
Number of LABs/CLBs-
Number of Logic Elements/Cells-
Total RAM Bits36864
Number of I/O114
Number of Gates250000
Voltage - Supply1.425V ~ 1.575V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case256-LBGA
Supplier Device Package256-FPBGA (17x17)

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Number of Logic Elements/Cells

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Total RAM Bits

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Voltage - Supply

1.15V ~ 1.25V

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Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

1508-BBGA, FCBGA

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AGL600V2-FGG256

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Series

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Number of LABs/CLBs

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Number of Logic Elements/Cells

13824

Total RAM Bits

110592

Number of I/O

177

Number of Gates

600000

Voltage - Supply

1.14V ~ 1.575V

Mounting Type

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Operating Temperature

0°C ~ 70°C (TA)

Package / Case

256-LBGA

Supplier Device Package

256-FPBGA (17x17)

Manufacturer

Xilinx Inc.

Series

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Number of LABs/CLBs

12160

Number of Logic Elements/Cells

155648

Total RAM Bits

7815168

Number of I/O

680

Number of Gates

-

Voltage - Supply

0.95V ~ 1.05V

Mounting Type

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Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1738-BBGA, FCBGA

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Voltage - Supply

1.14V ~ 1.26V

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Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

320-BGA

Supplier Device Package

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