5SGXMA3K2F35I3N
For Reference Only
| Part Number | 5SGXMA3K2F35I3N |
| PNEDA Part # | 5SGXMA3K2F35I3N |
| Description | IC FPGA 432 I/O 1152FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 4,572 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 24 - Nov 29 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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5SGXMA3K2F35I3N Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | 5SGXMA3K2F35I3N |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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5SGXMA3K2F35I3N Specifications
| Manufacturer | Intel |
| Series | Stratix® V GX |
| Number of LABs/CLBs | 128300 |
| Number of Logic Elements/Cells | 340000 |
| Total RAM Bits | 23704576 |
| Number of I/O | 432 |
| Number of Gates | - |
| Voltage - Supply | 0.82V ~ 0.88V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
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Manufacturer Intel Series Stratix® V GX Number of LABs/CLBs 359200 Number of Logic Elements/Cells 952000 Total RAM Bits 65561600 Number of I/O 600 Number of Gates - Voltage - Supply 0.87V ~ 0.93V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-HBGA (45x45) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 36864 Number of I/O 114 Number of Gates 250000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 119 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series IGLOO PLUS Number of LABs/CLBs - Number of Logic Elements/Cells 3120 Total RAM Bits 36864 Number of I/O 212 Number of Gates 125000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 289-TFBGA, CSBGA Supplier Device Package 289-CSP (14x14) |
Manufacturer Lattice Semiconductor Corporation Series ECP2 Number of LABs/CLBs 8500 Number of Logic Elements/Cells 68000 Total RAM Bits 1056768 Number of I/O 500 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 672-BBGA Supplier Device Package 672-FPBGA (27x27) |
