5SGXMA3E2H29C3N
For Reference Only
| Part Number | 5SGXMA3E2H29C3N |
| PNEDA Part # | 5SGXMA3E2H29C3N |
| Description | IC FPGA 360 I/O 780HBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 8,838 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 28 - Dec 3 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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5SGXMA3E2H29C3N Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | 5SGXMA3E2H29C3N |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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5SGXMA3E2H29C3N Specifications
| Manufacturer | Intel |
| Series | Stratix® V GX |
| Number of LABs/CLBs | 128300 |
| Number of Logic Elements/Cells | 340000 |
| Total RAM Bits | 23704576 |
| Number of I/O | 360 |
| Number of Gates | - |
| Voltage - Supply | 0.82V ~ 0.88V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 780-BBGA, FCBGA |
| Supplier Device Package | 780-HBGA (33x33) |
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Manufacturer Intel Series Stratix® V GX Number of LABs/CLBs 359200 Number of Logic Elements/Cells 952000 Total RAM Bits 65561600 Number of I/O 600 Number of Gates - Voltage - Supply 0.82V ~ 0.88V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-HBGA (45x45) |
Manufacturer Intel Series FLEX 8000 Number of LABs/CLBs 63 Number of Logic Elements/Cells 504 Total RAM Bits - Number of I/O 136 Number of Gates 6000 Voltage - Supply 4.75V ~ 5.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Intel Series MAX® 10 Number of LABs/CLBs 1000 Number of Logic Elements/Cells 16000 Total RAM Bits 562176 Number of I/O 178 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FBGA (17x17) |
Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 27696 Total RAM Bits 1130496 Number of I/O 138 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LFBGA Supplier Device Package 256-FPBGA (14x14) |
Manufacturer Microsemi Corporation Series Axcelerator Number of LABs/CLBs 4224 Number of Logic Elements/Cells - Total RAM Bits 55296 Number of I/O 138 Number of Gates 250000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 85°C (TA) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
