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5SGXEB6R2F43C2LN

5SGXEB6R2F43C2LN

For Reference Only

Part Number 5SGXEB6R2F43C2LN
PNEDA Part # 5SGXEB6R2F43C2LN
Description IC FPGA 600 I/O 1760FBGA
Manufacturer Intel
Unit Price Request a Quote
In Stock 7,020
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Mar 18 - Mar 23 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

5SGXEB6R2F43C2LN Resources

Brand Intel
ECAD Module ECAD
Mfr. Part Number5SGXEB6R2F43C2LN
CategorySemiconductorsEmbedded Processors & ControllersFPGAs (Field Programmable Gate Array)
Datasheet
5SGXEB6R2F43C2LN, 5SGXEB6R2F43C2LN Datasheet (Total Pages: 72, Size: 2,024.93 KB)
PDF5SGTMC7K3F40I2N Datasheet Cover
5SGTMC7K3F40I2N Datasheet Page 2 5SGTMC7K3F40I2N Datasheet Page 3 5SGTMC7K3F40I2N Datasheet Page 4 5SGTMC7K3F40I2N Datasheet Page 5 5SGTMC7K3F40I2N Datasheet Page 6 5SGTMC7K3F40I2N Datasheet Page 7 5SGTMC7K3F40I2N Datasheet Page 8 5SGTMC7K3F40I2N Datasheet Page 9 5SGTMC7K3F40I2N Datasheet Page 10 5SGTMC7K3F40I2N Datasheet Page 11

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5SGXEB6R2F43C2LN Specifications

ManufacturerIntel
SeriesStratix® V GX
Number of LABs/CLBs225400
Number of Logic Elements/Cells597000
Total RAM Bits61688832
Number of I/O600
Number of Gates-
Voltage - Supply0.82V ~ 0.88V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-FBGA, FC (42.5x42.5)

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Manufacturer

Intel

Series

Stratix® III L

Number of LABs/CLBs

4300

Number of Logic Elements/Cells

107500

Total RAM Bits

4992000

Number of I/O

488

Number of Gates

-

Voltage - Supply

0.86V ~ 1.15V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

780-BBGA, FCBGA

Supplier Device Package

780-FBGA (29x29)

Manufacturer

Xilinx Inc.

Series

Virtex®

Number of LABs/CLBs

2400

Number of Logic Elements/Cells

10800

Total RAM Bits

81920

Number of I/O

166

Number of Gates

468252

Voltage - Supply

2.375V ~ 2.625V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

240-BFQFP Exposed Pad

Supplier Device Package

240-PQFP (32x32)

M1A3P1000-1FGG484

Microsemi

Manufacturer

Microsemi Corporation

Series

ProASIC3

Number of LABs/CLBs

-

Number of Logic Elements/Cells

-

Total RAM Bits

147456

Number of I/O

300

Number of Gates

1000000

Voltage - Supply

1.425V ~ 1.575V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FPBGA (23x23)

LAE3-17EA-6LFN484E

Lattice Semiconductor Corporation

Manufacturer

Lattice Semiconductor Corporation

Series

LA-ECP3

Number of LABs/CLBs

2125

Number of Logic Elements/Cells

17000

Total RAM Bits

716800

Number of I/O

222

Number of Gates

-

Voltage - Supply

1.14V ~ 1.26V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 125°C (TJ)

Package / Case

484-BBGA

Supplier Device Package

484-FPBGA (23x23)

M1A3P400-1FG144I

Microsemi

Manufacturer

Microsemi Corporation

Series

ProASIC3

Number of LABs/CLBs

-

Number of Logic Elements/Cells

-

Total RAM Bits

55296

Number of I/O

97

Number of Gates

400000

Voltage - Supply

1.425V ~ 1.575V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

144-LBGA

Supplier Device Package

144-FPBGA (13x13)

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