5SGXEB6R2F43C2LN
For Reference Only
| Part Number | 5SGXEB6R2F43C2LN |
| PNEDA Part # | 5SGXEB6R2F43C2LN |
| Description | IC FPGA 600 I/O 1760FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 7,020 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Mar 20 - Mar 25 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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5SGXEB6R2F43C2LN Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | 5SGXEB6R2F43C2LN |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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5SGXEB6R2F43C2LN Specifications
| Manufacturer | Intel |
| Series | Stratix® V GX |
| Number of LABs/CLBs | 225400 |
| Number of Logic Elements/Cells | 597000 |
| Total RAM Bits | 61688832 |
| Number of I/O | 600 |
| Number of Gates | - |
| Voltage - Supply | 0.82V ~ 0.88V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FBGA, FC (42.5x42.5) |
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Manufacturer Xilinx Inc. Series Virtex® Number of LABs/CLBs 2400 Number of Logic Elements/Cells 10800 Total RAM Bits 81920 Number of I/O 166 Number of Gates 468252 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 240-BFQFP Exposed Pad Supplier Device Package 240-PQFP (32x32) |
Manufacturer Intel Series Stratix® V GX Number of LABs/CLBs 359200 Number of Logic Elements/Cells 952000 Total RAM Bits 65561600 Number of I/O 696 Number of Gates - Voltage - Supply 0.87V ~ 0.93V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-HBGA (45x45) |
Manufacturer Intel Series FLEX 6000 Number of LABs/CLBs 132 Number of Logic Elements/Cells 1320 Total RAM Bits - Number of I/O 171 Number of Gates 16000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-BGA Supplier Device Package 256-FBGA (17x17) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 119 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
