5SGSMD3E3H29I3L
For Reference Only
| Part Number | 5SGSMD3E3H29I3L |
| PNEDA Part # | 5SGSMD3E3H29I3L |
| Description | IC FPGA 360 I/O 780HBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 8,766 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 3 - Apr 8 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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5SGSMD3E3H29I3L Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | 5SGSMD3E3H29I3L |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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5SGSMD3E3H29I3L Specifications
| Manufacturer | Intel |
| Series | Stratix® V GS |
| Number of LABs/CLBs | 89000 |
| Number of Logic Elements/Cells | 236000 |
| Total RAM Bits | 16937984 |
| Number of I/O | 360 |
| Number of Gates | - |
| Voltage - Supply | 0.82V ~ 0.88V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 780-BBGA, FCBGA |
| Supplier Device Package | 780-HBGA (33x33) |
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Manufacturer Microsemi Corporation Series ProASIC3 Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 147456 Number of I/O 154 Number of Gates 1000000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Xilinx Inc. Series Spartan®-XL Number of LABs/CLBs 196 Number of Logic Elements/Cells 466 Total RAM Bits 6272 Number of I/O 112 Number of Gates 10000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Manufacturer Intel Series Cyclone® IV E Number of LABs/CLBs 1803 Number of Logic Elements/Cells 28848 Total RAM Bits 608256 Number of I/O 328 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FBGA (23x23) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 119 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
