Microchip Technology Memory
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CategorySemiconductors / Memory ICs / Memory
ManufacturerMicrochip Technology
Records 9,021
Page 133/301
Image |
Part Number |
Manufacturer |
Description |
In Stock |
Quantity |
Series | Memory Type | Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28TSOP |
3,546 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
|
|
|
Microchip Technology |
IC EEPROM 512K SPI 20MHZ 8SOIC |
2,538 |
|
- | Non-Volatile | EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5V ~ 5.5V | -55°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
|
Microchip Technology |
IC EEPROM 256K SPI 10MHZ 8DFN |
2,520 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -55°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
|
|
|
Microchip Technology |
IC EEPROM 256K SPI 10MHZ 8DFN |
7,650 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -55°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32PLCC |
7,614 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (13.97x11.43) |
|
|
|
Microchip Technology |
IC EEPROM 1M PARALLEL 32TSOP |
4,536 |
|
- | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
6,246 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
289 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
8,550 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
51 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
4,619 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
7,776 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
4,608 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
8,622 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
7,452 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
1,339 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
4,644 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
2,700 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
7,542 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
3,696 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
1,974 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
6,660 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
3,526 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
4,212 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
8,262 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
7,092 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
5,148 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
32 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
659 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
6,606 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |