Instant Offers

Part Number	Description	In Stock
XCZU19EG-L1FFVC1760I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	In Stock3,049
XCZU11EG-2FFVC1760I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	In Stock421
XCZU17EG-2FFVC1760E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	In Stock7,115
XCZU15EG-L1FFVB1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock478
XCZU15EG-1FFVB1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock225
XCZU9EG-2FFVC900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock2,763
XCZU15EG-1FFVB1156E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock279
XC7Z045-3FFG900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 1GHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1GHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock1,183
XCZU6CG-1FFVB1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC CG Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock3,261
XC7Z100-1FFG900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock4,490
XC7Z035-L2FFG900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock481
XC7Z035-1FFG900I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock1,005
XC7Z035-L2FBG676I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock9,292
XC7Z035-3FBG676E Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock15
XC7Z035-2FBG676I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock2,065
XCZU4EV-1FBVB900E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EV Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	In Stock6,177
XC7Z035-1FBG676I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock103
XCZU2EG-2SFVC784I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock2,377
M2S150TS-1FCG1152 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 1152BGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	In Stock4,513
XCZU2EG-1SFVC784E Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	In Stock2,187
M2S090T-1FGG676 Microsemi	SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA Manufacturer: Microsemi Corporation Series: SmartFusion®2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	In Stock2,399
XCZU9EG-2FFVB1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA Manufacturer: Xilinx Inc. Series: Zynq® UltraScale+™ MPSoC EG Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock793
5CSEBA2U23C8N Intel	SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 672UBGA Manufacturer: Intel Series: Cyclone® V SE Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz Primary Attributes: FPGA - 25K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	In Stock127
XC7Z045-2FFG676I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	In Stock644
5CSEMA6U23I7N Intel	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 672UBGA Manufacturer: Intel Series: Cyclone® V SE Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	In Stock966
5CSEBA6U23C7N Intel	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 672UBGA Manufacturer: Intel Series: Cyclone® V SE Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	In Stock1,520
5CSXFC6D6F31I7N Intel	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 896FBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock416
XC7Z100-2FFG1156I Xilinx	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 1156BGA Manufacturer: Xilinx Inc. Series: Zynq®-7000 Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	In Stock296
5CSXFC6D6F31C6N Intel	SoC (System On Chip) IC SOC CORTEX-A9 925MHZ 896FBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	In Stock1
5CSXFC6C6U23I7N Intel	SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 672UBGA Manufacturer: Intel Series: Cyclone® V SX Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	In Stock157

XCZU19EG-L1FFVC1760I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

In Stock3,049

XCZU11EG-2FFVC1760I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

In Stock421

XCZU17EG-2FFVC1760E

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 1760FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

In Stock7,115

XCZU15EG-L1FFVB1156I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

In Stock478

XCZU15EG-1FFVB1156I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

In Stock225

XCZU9EG-2FFVC900I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

In Stock2,763

XCZU15EG-1FFVB1156E

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

In Stock279

XC7Z045-3FFG900E

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A9 1GHZ 900FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1GHz
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

In Stock1,183

XCZU6CG-1FFVB1156I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC CG
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

In Stock3,261

XC7Z100-1FFG900I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 900FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

In Stock4,490

XC7Z035-L2FFG900I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

In Stock481

XC7Z035-1FFG900I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 900FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

In Stock1,005

XC7Z035-L2FBG676I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

In Stock9,292

XC7Z035-3FBG676E

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

In Stock15

XC7Z035-2FBG676I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

In Stock2,065

XCZU4EV-1FBVB900E

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EV
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

In Stock6,177

XC7Z035-1FBG676I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 676FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

In Stock103

XCZU2EG-2SFVC784I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

In Stock2,377

M2S150TS-1FCG1152

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

Manufacturer: Microsemi Corporation
Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

In Stock4,513

XCZU2EG-1SFVC784E

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

In Stock2,187

M2S090T-1FGG676

Microsemi

SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

Manufacturer: Microsemi Corporation
Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

In Stock2,399

XCZU9EG-2FFVB1156I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

In Stock793

5CSEBA2U23C8N

Intel

SoC (System On Chip)

IC SOC CORTEX-A9 600MHZ 672UBGA

Manufacturer: Intel
Series: Cyclone® V SE
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz
Primary Attributes: FPGA - 25K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

In Stock127

XC7Z045-2FFG676I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

In Stock644

5CSEMA6U23I7N

Intel

SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 672UBGA

Manufacturer: Intel
Series: Cyclone® V SE
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

In Stock966

5CSEBA6U23C7N

Intel

SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 672UBGA

Manufacturer: Intel
Series: Cyclone® V SE
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

In Stock1,520

5CSXFC6D6F31I7N

Intel

SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 896FBGA

Manufacturer: Intel
Series: Cyclone® V SX
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

In Stock416

XC7Z100-2FFG1156I

Xilinx

SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 1156BGA

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

In Stock296

5CSXFC6D6F31C6N

Intel

SoC (System On Chip)

IC SOC CORTEX-A9 925MHZ 896FBGA

Manufacturer: Intel
Series: Cyclone® V SX
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 925MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

In Stock1

5CSXFC6C6U23I7N

Intel

SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 672UBGA

Manufacturer: Intel
Series: Cyclone® V SX
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

In Stock157

Send Message

Certifications

Instant Offers

Resources

Support

Social Media

Need Help?
Send Message