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W25Q32BVZPIG Datasheet

W25Q32BVZPIG Datasheet
Total Pages: 79
Size: 932.16 KB
Winbond Electronics
This datasheet covers 3 part numbers: W25Q32BVZPIG, W25Q32BVSSIG, W25Q32BVSFIG
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W25Q32BVZPIG

Winbond Electronics

Manufacturer

Winbond Electronics

Series

SpiFlash®

Memory Type

Non-Volatile

Memory Format

FLASH

Technology

FLASH - NOR

Memory Size

32Mb (4M x 8)

Memory Interface

SPI - Quad I/O

Clock Frequency

104MHz

Write Cycle Time - Word, Page

50µs, 3ms

Access Time

-

Voltage - Supply

2.7V ~ 3.6V

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

8-WDFN Exposed Pad

Supplier Device Package

8-WSON (6x5)

W25Q32BVSSIG

Winbond Electronics

Manufacturer

Winbond Electronics

Series

SpiFlash®

Memory Type

Non-Volatile

Memory Format

FLASH

Technology

FLASH - NOR

Memory Size

32Mb (4M x 8)

Memory Interface

SPI - Quad I/O

Clock Frequency

104MHz

Write Cycle Time - Word, Page

50µs, 3ms

Access Time

-

Voltage - Supply

2.7V ~ 3.6V

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

8-SOIC (0.209", 5.30mm Width)

Supplier Device Package

8-SOIC

W25Q32BVSFIG

Winbond Electronics

Manufacturer

Winbond Electronics

Series

SpiFlash®

Memory Type

Non-Volatile

Memory Format

FLASH

Technology

FLASH - NOR

Memory Size

32Mb (4M x 8)

Memory Interface

SPI - Quad I/O

Clock Frequency

104MHz

Write Cycle Time - Word, Page

50µs, 3ms

Access Time

-

Voltage - Supply

2.7V ~ 3.6V

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

16-SOIC (0.295", 7.50mm Width)

Supplier Device Package

16-SOIC