SAC57D54HCVMO Datasheet
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Manufacturer NXP USA Inc. Series MAC57Dxxx Core Processor ARM® Cortex®-A5, -M4, -M0+ Core Size 32-Bit Tri-Core Speed 80MHz, 160MHz, 320MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI Peripherals DMA, LCD, LVD/HVD, POR, PWM, WDT Number of I/O - Program Memory Size 4MB (4M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2.3M x 8 Voltage - Supply (Vcc/Vdd) 3.15V ~ 5.5V Data Converters A/D 24x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 516-BGA Supplier Device Package 516-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MAC57Dxxx Core Processor ARM® Cortex®-A5, -M4, -M0+ Core Size 32-Bit Tri-Core Speed 80MHz, 160MHz, 320MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI Peripherals DMA, LCD, LVD/HVD, POR, PWM, WDT Number of I/O - Program Memory Size 4MB (4M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2.3M x 8 Voltage - Supply (Vcc/Vdd) 3.15V ~ 5.5V Data Converters A/D 24x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 208-LQFP Exposed Pad Supplier Device Package 208-LQFP (28x28) |
