S1C17W22F00B100 Datasheet

Epson Electronics

Manufacturer

Epson Electronics America Inc-Semiconductor Div

Series

-

Core Processor

S1C17

Core Size

16-Bit

Speed

4.2MHz

Connectivity

I²C, IrDA, SPI, UART/USART

Peripherals

LCD, PWM, RFC, WDT

Number of I/O

41

Program Memory Size

64KB (64K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

4K x 8

Voltage - Supply (Vcc/Vdd)

1.2V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

128-TQFP

Supplier Device Package

-

Epson Electronics

Manufacturer

Epson Electronics America Inc-Semiconductor Div

Series

-

Core Processor

S1C17

Core Size

16-Bit

Speed

4.2MHz

Connectivity

I²C, IrDA, SPI, UART/USART

Peripherals

LCD, PWM, RFC, WDT

Number of I/O

41

Program Memory Size

64KB (64K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

4K x 8

Voltage - Supply (Vcc/Vdd)

1.2V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

Die

Supplier Device Package

Die

Epson Electronics

Manufacturer

Epson Electronics America Inc-Semiconductor Div

Series

*

Core Processor

-

Core Size

-

Speed

-

Connectivity

-

Peripherals

-

Number of I/O

-

Program Memory Size

-

Program Memory Type

-

EEPROM Size

-

RAM Size

-

Voltage - Supply (Vcc/Vdd)

-

Data Converters

-

Oscillator Type

-

Operating Temperature

-

Mounting Type

-

Package / Case

-

Supplier Device Package

-

Epson Electronics

Manufacturer

Epson Electronics America Inc-Semiconductor Div

Series

*

Core Processor

-

Core Size

-

Speed

-

Connectivity

-

Peripherals

-

Number of I/O

-

Program Memory Size

-

Program Memory Type

-

EEPROM Size

-

RAM Size

-

Voltage - Supply (Vcc/Vdd)

-

Data Converters

-

Oscillator Type

-

Operating Temperature

-

Mounting Type

-

Package / Case

-

Supplier Device Package

-

Epson Electronics

Manufacturer

Epson Electronics America Inc-Semiconductor Div

Series

-

Core Processor

S1C17

Core Size

16-Bit

Speed

4.2MHz

Connectivity

I²C, IrDA, SPI, UART/USART

Peripherals

LCD, PWM, RFC, WDT

Number of I/O

41

Program Memory Size

64KB (64K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

4K x 8

Voltage - Supply (Vcc/Vdd)

1.2V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

Die

Supplier Device Package

Die

Epson Electronics

Manufacturer

Epson Electronics America Inc-Semiconductor Div

Series

-

Core Processor

S1C17

Core Size

16-Bit

Speed

4.2MHz

Connectivity

I²C, IrDA, SPI, UART/USART

Peripherals

LCD, PWM, RFC, WDT

Number of I/O

41

Program Memory Size

96KB (96K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

8K x 8

Voltage - Supply (Vcc/Vdd)

1.2V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

128-TQFP

Supplier Device Package

128-TQFP (14x14)

Epson Electronics

Manufacturer

Epson Electronics America Inc-Semiconductor Div

Series

-

Core Processor

S1C17

Core Size

16-Bit

Speed

4.2MHz

Connectivity

I²C, IrDA, SPI, UART/USART

Peripherals

LCD, PWM, RFC, WDT

Number of I/O

41

Program Memory Size

64KB (64K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

4K x 8

Voltage - Supply (Vcc/Vdd)

1.2V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

128-TQFP

Supplier Device Package

128-TQFP (14x14)