S1C17F57F401100 Datasheet
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Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 4.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals PWM, WDT Number of I/O 29 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 128-LQFP Supplier Device Package - |
Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 4.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals PWM, WDT Number of I/O 29 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case Die Supplier Device Package - |
Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 4.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals PWM, WDT Number of I/O 29 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case Die Supplier Device Package - |
