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P89LPC9251FDH Datasheet

P89LPC9251FDH Datasheet
Total Pages: 75
Size: 430.95 KB
NXP
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Manufacturer

NXP USA Inc.

Series

LPC900

Core Processor

8051

Core Size

8-Bit

Speed

18MHz

Connectivity

I²C, UART/USART

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O

18

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

2.4V ~ 3.6V

Data Converters

A/D 4x8b; D/A 1x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

20-TSSOP

Manufacturer

NXP USA Inc.

Series

LPC900

Core Processor

8051

Core Size

8-Bit

Speed

18MHz

Connectivity

I²C, UART/USART

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O

18

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

2.4V ~ 3.6V

Data Converters

A/D 4x8b; D/A 1x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

20-TSSOP

Manufacturer

NXP USA Inc.

Series

LPC900

Core Processor

8051

Core Size

8-Bit

Speed

18MHz

Connectivity

I²C, UART/USART

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O

18

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

2.4V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

20-DIP (0.300", 7.62mm)

Supplier Device Package

20-DIP

Manufacturer

NXP USA Inc.

Series

LPC900

Core Processor

8051

Core Size

8-Bit

Speed

18MHz

Connectivity

I²C, UART/USART

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O

18

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

2.4V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

20-TSSOP

Manufacturer

NXP USA Inc.

Series

LPC900

Core Processor

8051

Core Size

8-Bit

Speed

18MHz

Connectivity

I²C, UART/USART

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O

18

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

2.4V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

20-TSSOP

Manufacturer

NXP USA Inc.

Series

LPC900

Core Processor

8051

Core Size

8-Bit

Speed

18MHz

Connectivity

I²C, UART/USART

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O

18

Program Memory Size

2KB (2K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

2.4V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

20-TSSOP