MM908E625ACDWB Datasheet
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Manufacturer NXP USA Inc. Series - Applications Automotive Mirror Control Core Processor HC08 Program Memory Type FLASH (16KB) Controller Series 908E RAM Size 512 x 8 Interface SCI, SPI Number of I/O 13 Voltage - Supply 8V ~ 18V Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 54-SOIC-EP |
Manufacturer NXP USA Inc. Series - Applications Automotive Mirror Control Core Processor HC08 Program Memory Type FLASH (16KB) Controller Series 908E RAM Size 512 x 8 Interface SCI, SPI Number of I/O 13 Voltage - Supply 8V ~ 18V Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 54-SOIC-EP |
Manufacturer NXP USA Inc. Series - Applications Automotive Mirror Control Core Processor HC08 Program Memory Type FLASH (16KB) Controller Series 908E RAM Size 512 x 8 Interface SCI, SPI Number of I/O 13 Voltage - Supply 8V ~ 18V Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 54-SOIC-EP |
Manufacturer NXP USA Inc. Series - Applications Automotive Mirror Control Core Processor HC08 Program Memory Type FLASH (16KB) Controller Series 908E RAM Size 512 x 8 Interface SCI, SPI Number of I/O 13 Voltage - Supply 8V ~ 18V Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 54-SOIC-EP |
