MKL33Z128VMP4 Datasheet
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Manufacturer NXP USA Inc. Series Kinetis KL3 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT Number of I/O 54 Program Memory Size 128KB (128K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 20x16b; D/A 1x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LFBGA Supplier Device Package 64-MAPBGA (5x5) |
Manufacturer NXP USA Inc. Series Kinetis KL3 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT Number of I/O 54 Program Memory Size 128KB (128K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 20x16b; D/A 1x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LQFP Supplier Device Package 64-LQFP (10x10) |
Manufacturer NXP USA Inc. Series Kinetis KL3 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT Number of I/O 54 Program Memory Size 256KB (256K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 32K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 20x16b; D/A 1x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LQFP Supplier Device Package 64-LQFP (10x10) |
Manufacturer NXP USA Inc. Series Kinetis KL3 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT Number of I/O 54 Program Memory Size 128KB (128K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 20x16b; D/A 1x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LQFP Supplier Device Package 64-LQFP (10x10) |
Manufacturer NXP USA Inc. Series Kinetis KL3 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT Number of I/O 54 Program Memory Size 256KB (256K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 32K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 20x16b; D/A 1x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LFBGA Supplier Device Package 64-MAPBGA (5x5) |
