MKL17Z64VLH4R Datasheet
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Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 54 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 20x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LQFP Supplier Device Package 64-LQFP (10x10) |
Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 32 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 15x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 36-XFBGA Supplier Device Package 36-XFBGA (3.5x3.5) |
Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 28 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 11x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 32-UFQFN Exposed Pad Supplier Device Package 32-QFN (5x5) |
Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 28 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 11x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 32-UFQFN Exposed Pad Supplier Device Package 32-QFN (5x5) |
Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 54 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 20x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LQFP Supplier Device Package 64-LQFP (10x10) |
Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 32 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 15x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 36-XFBGA Supplier Device Package 36-XFBGA (3.5x3.5) |
Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 32 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 15x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 36-XFBGA Supplier Device Package 36-XFBGA (3.5x3.5) |
Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 54 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 20x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LQFP Supplier Device Package 64-LQFP (10x10) |
Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 32 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 15x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 36-XFBGA Supplier Device Package 36-XFBGA (3.5x3.5) |
Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 28 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 11x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 32-UFQFN Exposed Pad Supplier Device Package 32-QFN (5x5) |
Manufacturer NXP USA Inc. Series Kinetis KL1 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART Peripherals DMA, I²S, PWM, WDT Number of I/O 28 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 11x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 32-UFQFN Exposed Pad Supplier Device Package 32-QFN (5x5) |
