MKE04Z8VWJ4R Datasheet
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Manufacturer NXP USA Inc. Series Kinetis KE04 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals LVD, PWM, WDT Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x12b; D/A 2x6b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 20-SOIC (0.295", 7.50mm Width) Supplier Device Package 20-SOIC |
Manufacturer NXP USA Inc. Series Kinetis KE04 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals LVD, PWM, WDT Number of I/O 22 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 12x12b; D/A 2x6b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 24-VFQFN Exposed Pad Supplier Device Package 24-QFN (4x4) |
Manufacturer NXP USA Inc. Series Kinetis KE04 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals LVD, PWM, WDT Number of I/O 14 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 6x12b; D/A 2x6b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
