MK60DN512ZAB10R Datasheet
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Manufacturer NXP USA Inc. Series Kinetis K60 Core Processor ARM® Cortex®-M4 Core Size 32-Bit Speed 100MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals DMA, I²S, LVD, POR, PWM, WDT Number of I/O - Program Memory Size 512KB (512K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 38x16b; D/A 2x12b Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 120-UFBGA, WLCSP Supplier Device Package 120-WLCSP (5.29x5.28) |
Manufacturer NXP USA Inc. Series Kinetis K60 Core Processor ARM® Cortex®-M4 Core Size 32-Bit Speed 100MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals DMA, I²S, LVD, POR, PWM, WDT Number of I/O - Program Memory Size 512KB (512K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 38x16b; D/A 2x12b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 120-UFBGA, WLCSP Supplier Device Package 120-WLCSP (5.29x5.28) |
