MCR908JK3ECPE Datasheet
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Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 15 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 20-DIP (0.300", 7.62mm) Supplier Device Package 20-DIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 23 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Through Hole Package / Case 28-DIP (0.600", 15.24mm) Supplier Device Package 28-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 23 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 28-SOIC (0.295", 7.50mm Width) Supplier Device Package 28-SOIC |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 23 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 48-LQFP Supplier Device Package 48-LQFP (7x7) |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 14 Program Memory Size 1.5KB (1.5K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 20-DIP (0.300", 7.62mm) Supplier Device Package 20-DIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 14 Program Memory Size 1.5KB (1.5K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 20-DIP (0.300", 7.62mm) Supplier Device Package 20-DIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 23 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Through Hole Package / Case 28-DIP (0.600", 15.24mm) Supplier Device Package 28-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 23 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 28-DIP (0.600", 15.24mm) Supplier Device Package 28-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 15 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 20-DIP (0.300", 7.62mm) Supplier Device Package 20-DIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 23 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 28-DIP (0.600", 15.24mm) Supplier Device Package 28-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 23 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 48-LQFP Supplier Device Package 48-LQFP (7x7) |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LED, LVD, POR, PWM Number of I/O 15 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V Data Converters A/D 12x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-SOIC (0.295", 7.50mm Width) Supplier Device Package 28-SOIC |
