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MCIMX6L7DVN10AA Datasheet

MCIMX6L7DVN10AA Datasheet
Total Pages: 104
Size: 820.24 KB
NXP
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Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)