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MCIMX515DJZK8C Datasheet

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Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

800MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-20°C ~ 85°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

527-TFBGA

Supplier Device Package

527-BGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

800MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-20°C ~ 85°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

600MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-40°C ~ 95°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

800MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-20°C ~ 85°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

800MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-20°C ~ 85°C (TC)

Security Features

Boot Security, Cryptography, Hardware ID, RTIC, Secure JTAG

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

600MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-40°C ~ 95°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

600MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-40°C ~ 95°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

600MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-40°C ~ 95°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

600MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-40°C ~ 95°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

800MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-20°C ~ 85°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

800MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-20°C ~ 85°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

600MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-40°C ~ 95°C (TC)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)