MCIMX515DJZK8C Datasheet
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 527-TFBGA Supplier Device Package 527-BGA (13x13) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features Boot Security, Cryptography, Hardware ID, RTIC, Secure JTAG Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
NXP Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |