MCHC11F1CFNE5 Datasheet
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Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 5MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 80-QFP Supplier Device Package 80-LQFP (14x14) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
