MC9S08QA2CPAE Datasheet
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Manufacturer NXP USA Inc. Series S08 Core Processor S08 Core Size 8-Bit Speed 20MHz Connectivity - Peripherals LVD, POR, PWM, WDT Number of I/O 4 Program Memory Size 2KB (2K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 160 x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 8-DIP (0.300", 7.62mm) Supplier Device Package 8-PDIP |
Manufacturer NXP USA Inc. Series S08 Core Processor S08 Core Size 8-Bit Speed 20MHz Connectivity - Peripherals LVD, POR, PWM, WDT Number of I/O 4 Program Memory Size 2KB (2K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 160 x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 8-VDFN Exposed Pad Supplier Device Package 8-DFN-EP (4x4) |
Manufacturer NXP USA Inc. Series S08 Core Processor S08 Core Size 8-Bit Speed 20MHz Connectivity - Peripherals LVD, POR, PWM, WDT Number of I/O 4 Program Memory Size 2KB (2K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 160 x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 8-SOIC (0.154", 3.90mm Width) Supplier Device Package 8-SOIC |
