MC908QB4MDTE Datasheet
|
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Through Hole Package / Case 16-DIP (0.300", 7.62mm) Supplier Device Package 16-DIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 16-SOIC (0.295", 7.50mm Width) Supplier Device Package 16-SOIC |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 4x10b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 16-DIP (0.300", 7.62mm) Supplier Device Package 16-DIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 4x10b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 16-SOIC (0.295", 7.50mm Width) Supplier Device Package 16-SOIC |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 4x10b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Through Hole Package / Case 16-DIP (0.300", 7.62mm) Supplier Device Package 16-DIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 16-SOIC (0.295", 7.50mm Width) Supplier Device Package 16-SOIC |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 16-DIP (0.300", 7.62mm) Supplier Device Package 16-DIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
