MC908LB8VDWER Datasheet
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVR, POR, PWM Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x8b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 20-SOIC (0.295", 7.50mm Width) Supplier Device Package 20-SOIC |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVR, POR, PWM Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x8b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 20-SOIC (0.295", 7.50mm Width) Supplier Device Package 20-SOIC |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVR, POR, PWM Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x8b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Through Hole Package / Case 20-DIP (0.300", 7.62mm) Supplier Device Package 20-DIP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVR, POR, PWM Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x8b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 20-SOIC (0.295", 7.50mm Width) Supplier Device Package 20-SOIC |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVR, POR, PWM Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x8b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Through Hole Package / Case 20-DIP (0.300", 7.62mm) Supplier Device Package 20-DIP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVR, POR, PWM Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x8b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 20-SOIC (0.295", 7.50mm Width) Supplier Device Package 20-SOIC |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVR, POR, PWM Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 20-DIP (0.300", 7.62mm) Supplier Device Package 20-DIP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVR, POR, PWM Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 20-SOIC (0.295", 7.50mm Width) Supplier Device Package 20-SOIC |