MC908GP32CPE Datasheet
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Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 33 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 40-DIP (0.600", 15.24mm) Supplier Device Package 40-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 31 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 42-SDIP (0.600", 15.24mm) Supplier Device Package 42-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 33 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-QFP Supplier Device Package 44-QFP (10x10) |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 31 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 42-SDIP (0.600", 15.24mm) Supplier Device Package 42-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 33 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 42-SDIP (0.600", 15.24mm) Supplier Device Package 42-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 33 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-QFP Supplier Device Package 44-QFP (10x10) |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 33 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-QFP Supplier Device Package 44-QFP (10x10) |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 33 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-QFP Supplier Device Package 44-QFP (10x10) |
