MC711P2CFNE3 Datasheet
|
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity MI Bus, SCI, SPI Peripherals POR, PWM, WDT Number of I/O 50 Program Memory Size 32KB (32K x 8) Program Memory Type OTP EEPROM Size 640 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.29x29.29) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity MI Bus, SCI, SPI Peripherals POR, PWM, WDT Number of I/O 50 Program Memory Size 32KB (32K x 8) Program Memory Type OTP EEPROM Size 640 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.29x29.29) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity MI Bus, SCI, SPI Peripherals POR, PWM, WDT Number of I/O 50 Program Memory Size 32KB (32K x 8) Program Memory Type OTP EEPROM Size 640 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.29x29.29) |
