MC68HC11K1VFNE4 Datasheet
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Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 37 Program Memory Size - Program Memory Type ROMless EEPROM Size 640 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.29x29.29) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 37 Program Memory Size - Program Memory Type ROMless EEPROM Size 640 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 80-QFP Supplier Device Package 80-QFP (14x14) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 37 Program Memory Size - Program Memory Type ROMless EEPROM Size 640 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 80-QFP Supplier Device Package 80-QFP (14x14) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 37 Program Memory Size - Program Memory Type ROMless EEPROM Size 640 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.29x29.29) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 37 Program Memory Size - Program Memory Type ROMless EEPROM Size 640 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.29x29.29) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 37 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 80-QFP Supplier Device Package 80-QFP (14x14) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 37 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.29x29.29) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 37 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.29x29.29) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 62 Program Memory Size 24KB (24K x 8) Program Memory Type OTP EEPROM Size 640 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.29x29.29) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 62 Program Memory Size 24KB (24K x 8) Program Memory Type OTP EEPROM Size 640 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.29x29.29) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 62 Program Memory Size 24KB (24K x 8) Program Memory Type OTP EEPROM Size 640 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 80-QFP Supplier Device Package 80-QFP (14x14) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, PWM, WDT Number of I/O 62 Program Memory Size 24KB (24K x 8) Program Memory Type OTP EEPROM Size 640 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 80-QFP Supplier Device Package 80-QFP (14x14) |
