MC68HC11E1VFNE3 Datasheet
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Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size 12KB (12K x 8) Program Memory Type OTP EEPROM Size 512 x 8 RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size 20KB (20K x 8) Program Memory Type OTP EEPROM Size 512 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 64-QFP Supplier Device Package 64-QFP (14x14) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size 20KB (20K x 8) Program Memory Type OTP EEPROM Size 512 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 64-QFP Supplier Device Package 64-QFP (14x14) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 52-LQFP Supplier Device Package 52-TQFP (10x10) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size 12KB (12K x 8) Program Memory Type OTP EEPROM Size 512 x 8 RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 512 x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
