MA4L031-186 Datasheet
M/A-Com Technology Solutions Manufacturer M/A-Com Technology Solutions Series - Diode Type PIN - Single Voltage - Peak Reverse (Max) 35V Current - Max 100mA Capacitance @ Vr, F 0.21pF @ 0V, 1MHz Resistance @ If, F 2Ohm @ 10mA, 500MHz Power Dissipation (Max) - Operating Temperature -55°C ~ 125°C (TJ) Package / Case Die Supplier Device Package Chip |
M/A-Com Technology Solutions Manufacturer M/A-Com Technology Solutions Series - Diode Type PIN - Single Voltage - Peak Reverse (Max) 50V Current - Max 100mA Capacitance @ Vr, F 0.15pF @ 0V, 1MHz Resistance @ If, F 2.5Ohm @ 10mA, 500MHz Power Dissipation (Max) - Operating Temperature -55°C ~ 125°C (TJ) Package / Case Die Supplier Device Package Chip |
M/A-Com Technology Solutions Manufacturer M/A-Com Technology Solutions Series - Diode Type PIN - Single Voltage - Peak Reverse (Max) 35V Current - Max 100mA Capacitance @ Vr, F - Resistance @ If, F 2Ohm @ 10mA, 500MHz Power Dissipation (Max) - Operating Temperature -55°C ~ 125°C (TJ) Package / Case Die Supplier Device Package Chip |
M/A-Com Technology Solutions Manufacturer M/A-Com Technology Solutions Series - Diode Type PIN - Single Voltage - Peak Reverse (Max) 35V Current - Max 100mA Capacitance @ Vr, F 0.2pF @ 0V, 1MHz Resistance @ If, F 2.1Ohm @ 10mA, 500MHz Power Dissipation (Max) - Operating Temperature -55°C ~ 125°C (TJ) Package / Case Die Supplier Device Package Chip |
M/A-Com Technology Solutions Manufacturer M/A-Com Technology Solutions Series - Diode Type PIN - Single Voltage - Peak Reverse (Max) 35V Current - Max 100mA Capacitance @ Vr, F 0.18pF @ 0V, 1MHz Resistance @ If, F 2.1Ohm @ 10mA, 500MHz Power Dissipation (Max) - Operating Temperature -55°C ~ 125°C (TJ) Package / Case Die Supplier Device Package Chip |
M/A-Com Technology Solutions Manufacturer M/A-Com Technology Solutions Series - Diode Type PIN - Single Voltage - Peak Reverse (Max) 35V Current - Max 100mA Capacitance @ Vr, F 0.19pF @ 0V, 1MHz Resistance @ If, F 2Ohm @ 10mA, 500MHz Power Dissipation (Max) - Operating Temperature -55°C ~ 125°C (TJ) Package / Case Die Supplier Device Package Chip |