M2S010S-TQ144I Datasheet
Microsemi Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Microsemi Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Microsemi Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Microsemi Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 60K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
Microsemi Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Microsemi Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Microsemi Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Microsemi Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Microsemi Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 12084 Total RAM Bits 933888 Number of I/O 84 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type - Operating Temperature -40°C ~ 100°C (TJ) Package / Case - Supplier Device Package - |
Microsemi Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 12084 Total RAM Bits 933888 Number of I/O 84 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type - Operating Temperature 0°C ~ 85°C (TJ) Package / Case - Supplier Device Package - |
Microsemi Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 12084 Total RAM Bits 933888 Number of I/O 84 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type - Operating Temperature -40°C ~ 100°C (TJ) Package / Case - Supplier Device Package - |
Microsemi Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 12084 Total RAM Bits 933888 Number of I/O 84 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case - Supplier Device Package - |