LPC2923FBD100 Datasheet
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Manufacturer NXP USA Inc. Series LPC2900 Core Processor ARM9® Core Size 16/32-Bit Speed 125MHz Connectivity CANbus, I²C, LINbus, SPI, UART/USART, USB Peripherals DMA, POR, PWM, WDT Number of I/O 60 Program Memory Size 256KB (256K x 8) Program Memory Type FLASH EEPROM Size 16K x 8 RAM Size 24K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 16x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-LQFP Supplier Device Package 100-LQFP (14x14) |
Manufacturer NXP USA Inc. Series LPC2900 Core Processor ARM9® Core Size 16/32-Bit Speed 125MHz Connectivity CANbus, I²C, LINbus, SPI, UART/USART, USB Peripherals DMA, POR, PWM, WDT Number of I/O 60 Program Memory Size 128KB (128K x 8) Program Memory Type FLASH EEPROM Size 16K x 8 RAM Size 24K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 16x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-LQFP Supplier Device Package 100-LQFP (14x14) |
Manufacturer NXP USA Inc. Series LPC2900 Core Processor ARM9® Core Size 16/32-Bit Speed 125MHz Connectivity CANbus, I²C, LINbus, SPI, UART/USART, USB Peripherals DMA, POR, PWM, WDT Number of I/O 60 Program Memory Size 512KB (512K x 8) Program Memory Type FLASH EEPROM Size 16K x 8 RAM Size 40K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 16x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-LQFP Supplier Device Package 100-LQFP (14x14) |
