LPC18S57JET256E Datasheet
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Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Number of I/O 164 Program Memory Size 1MB (1M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 136K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-LBGA (17x17) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT Number of I/O 49 Program Memory Size 1MB (1M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 136K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 4x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 100-TFBGA Supplier Device Package 100-TFBGA (9x9) |
