LPC1114LVFHI33/303 Datasheet
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Manufacturer NXP USA Inc. Series LPC1100LV Core Processor ARM® Cortex®-M0 Core Size 32-Bit Speed 50MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, WDT Number of I/O 27 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.65V ~ 1.95V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 32-VFQFN Exposed Pad Supplier Device Package 32-HVQFN (5x5) |
Manufacturer NXP USA Inc. Series LPC1100LV Core Processor ARM® Cortex®-M0 Core Size 32-Bit Speed 50MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, WDT Number of I/O 20 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.65V ~ 1.95V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 24-VFQFN Exposed Pad Supplier Device Package 24-HVQFN (4x4) |
Manufacturer NXP USA Inc. Series LPC1100LV Core Processor ARM® Cortex®-M0 Core Size 32-Bit Speed 50MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, WDT Number of I/O 27 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.65V ~ 1.95V Data Converters A/D 6x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 32-VFQFN Exposed Pad Supplier Device Package - |
Manufacturer NXP USA Inc. Series LPC1100LV Core Processor ARM® Cortex®-M0 Core Size 32-Bit Speed 50MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, WDT Number of I/O 20 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.65V ~ 1.95V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 24-VFQFN Exposed Pad Supplier Device Package 24-HVQFN (4x4) |
Manufacturer NXP USA Inc. Series LPC1100LV Core Processor ARM® Cortex®-M0 Core Size 32-Bit Speed 50MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, WDT Number of I/O 21 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.65V ~ 1.95V Data Converters A/D 6x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 25-UFBGA, WLCSP Supplier Device Package - |
Manufacturer NXP USA Inc. Series LPC1100LV Core Processor ARM® Cortex®-M0 Core Size 32-Bit Speed 50MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, WDT Number of I/O 20 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.65V ~ 1.95V Data Converters A/D 6x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 24-VFQFN Exposed Pad Supplier Device Package 24-HVQFN (4x4) |
Manufacturer NXP USA Inc. Series LPC1100LV Core Processor ARM® Cortex®-M0 Core Size 32-Bit Speed 50MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, WDT Number of I/O 21 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.65V ~ 1.95V Data Converters A/D 6x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 25-UFBGA, WLCSP Supplier Device Package - |
