LAXP2-17E-5QN208E Datasheet
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Manufacturer Lattice Semiconductor Corporation Series LA-XP2 Number of LABs/CLBs 2125 Number of Logic Elements/Cells 17000 Total RAM Bits 282624 Number of I/O 146 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Lattice Semiconductor Corporation Series LA-XP2 Number of LABs/CLBs 2125 Number of Logic Elements/Cells 17000 Total RAM Bits 282624 Number of I/O 201 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FTBGA (17x17) |
Manufacturer Lattice Semiconductor Corporation Series LA-XP2 Number of LABs/CLBs 1000 Number of Logic Elements/Cells 8000 Total RAM Bits 226304 Number of I/O 146 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Lattice Semiconductor Corporation Series LA-XP2 Number of LABs/CLBs 1000 Number of Logic Elements/Cells 8000 Total RAM Bits 226304 Number of I/O 201 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FTBGA (17x17) |
Manufacturer Lattice Semiconductor Corporation Series LA-XP2 Number of LABs/CLBs 625 Number of Logic Elements/Cells 5000 Total RAM Bits 169984 Number of I/O 146 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Lattice Semiconductor Corporation Series LA-XP2 Number of LABs/CLBs 1000 Number of Logic Elements/Cells 8000 Total RAM Bits 226304 Number of I/O 100 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Manufacturer Lattice Semiconductor Corporation Series LA-XP2 Number of LABs/CLBs 1000 Number of Logic Elements/Cells 8000 Total RAM Bits 226304 Number of I/O 86 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 132-LFBGA, CSPBGA Supplier Device Package 132-CSBGA (8x8) |
Manufacturer Lattice Semiconductor Corporation Series LA-XP2 Number of LABs/CLBs 625 Number of Logic Elements/Cells 5000 Total RAM Bits 169984 Number of I/O 172 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FTBGA (17x17) |
Manufacturer Lattice Semiconductor Corporation Series LA-XP2 Number of LABs/CLBs 625 Number of Logic Elements/Cells 5000 Total RAM Bits 169984 Number of I/O 100 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Manufacturer Lattice Semiconductor Corporation Series LA-XP2 Number of LABs/CLBs 625 Number of Logic Elements/Cells 5000 Total RAM Bits 169984 Number of I/O 86 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 132-LFBGA, CSPBGA Supplier Device Package 132-CSBGA (8x8) |
