A2F060M3E-FGG256M Datasheet
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Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature -55°C ~ 125°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature -55°C ~ 125°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 100MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature -55°C ~ 125°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 100MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature -55°C ~ 125°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
