5CSXFC6D6F31I7NES Datasheet
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Manufacturer Intel Series Cyclone® V SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 800MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature -40°C ~ 100°C (TJ) Package / Case 896-BGA Supplier Device Package 896-FBGA (31x31) |
Manufacturer Intel Series Cyclone® V SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 800MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature -40°C ~ 100°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Cyclone® V SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature 0°C ~ 85°C (TJ) Package / Case 896-BGA Supplier Device Package 896-FBGA (31x31) |
Manufacturer Intel Series Cyclone® V SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature 0°C ~ 85°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-FBGA Supplier Device Package 484-UBGA (19x19) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 896-BGA Supplier Device Package 896-FBGA (31x31) |
Manufacturer Intel Series Cyclone® V SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 925MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature 0°C ~ 85°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Cyclone® V SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 800MHz Primary Attributes FPGA - 110K Logic Elements Operating Temperature 0°C ~ 85°C (TJ) Package / Case 896-BGA Supplier Device Package 896-FBGA (31x31) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 85K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
