5CSXFC4C6U23A7N Datasheet
|
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 40K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 40K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 40K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 25K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 40K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 484-FBGA Supplier Device Package 484-UBGA (19x19) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 25K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 25K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 672-FBGA Supplier Device Package 672-UBGA (23x23) |
Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 25K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 484-FBGA Supplier Device Package 484-UBGA (19x19) |
Manufacturer Intel Series MAX® 10 Number of LABs/CLBs 250 Number of Logic Elements/Cells 4000 Total RAM Bits 193536 Number of I/O 178 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FBGA (17x17) |
